Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114314 | Method for fabrication of a semiconductor structure including an interposer free from any through via | Bich-Yen Nguyen, Ludovic Ecarnot, Christophe Malville | 2021-09-07 |
| 10950491 | Method for transferring a useful layer | Didier Landru, Oleg Kononchuk, Frédéric Mazen, Damien Massy, Shay Reboh +1 more | 2021-03-16 |