Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195812 | Method for fabricating an encapsulated electronic package using a supporting plate | Cheng-Kai Chang, Bo MA, Chun-Chi Ke | 2021-12-07 |
| 11114412 | Electronic package and method for fabricating the same | Cheng-Kai Chang | 2021-09-07 |