Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195812 | Method for fabricating an encapsulated electronic package using a supporting plate | Hsin-Yi Liao, Cheng-Kai Chang, Chun-Chi Ke | 2021-12-07 |
| 11163204 | Array substrate, display panel including the same, and display device | Hong-Da Liu, Yezhou Fang, Fengguo Wang, Xinguo Wu, Zhixuan Guo +3 more | 2021-11-02 |