Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195812 | Method for fabricating an encapsulated electronic package using a supporting plate | Hsin-Yi Liao, Cheng-Kai Chang, Bo MA | 2021-12-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195812 | Method for fabricating an encapsulated electronic package using a supporting plate | Hsin-Yi Liao, Cheng-Kai Chang, Bo MA | 2021-12-07 |