Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195812 | Method for fabricating an encapsulated electronic package using a supporting plate | Hsin-Yi Liao, Bo MA, Chun-Chi Ke | 2021-12-07 |
| 11143549 | Electronic packaging structure and method for manufacturing the electronic packaging structure with optical guide die separate from electronic package and photonic die | Jin-Wei You | 2021-10-12 |
| 11114412 | Electronic package and method for fabricating the same | Hsin-Yi Liao | 2021-09-07 |