Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11041045 | Resin composition, prepreg, laminate and multilayer printed wiring board | Yuki Nagai, Yasuyuki Mizuno, Tomio Fukuda, Hikari Murai | 2021-06-22 |
| 10957964 | Multilayer transmission line plate | Tetsurou Irino, Yuusuke Kondou, Etsuo Mizushima, Tomio Fukuda, Yuki Nagai | 2021-03-23 |
| 10907029 | Resin composition, resin layer-provided support, prepreg, laminate sheet, multilayer printed wiring board, and printed wiring board for millimeter-wave radar | Tetsuroh Irino, Minoru Kakitani, Kouji Morita | 2021-02-02 |