Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11136454 | Thermosetting resin composition and its production method, prepreg, laminate, and printed wiring board | Keisuke Kushida, Hiroshi Shimizu, Yoshikatsu Shiraokawa, Tatsunori Kaneko | 2021-10-05 |
| 10940674 | Resin varnish, prepreg, laminate, and printed wiring board | Yoshikatsu Shiraokawa, Hiroshi Shimizu, Keisuke Kushida, Tatsunori Kaneko | 2021-03-09 |
| 10907029 | Resin composition, resin layer-provided support, prepreg, laminate sheet, multilayer printed wiring board, and printed wiring board for millimeter-wave radar | Takao Tanigawa, Tetsuroh Irino, Kouji Morita | 2021-02-02 |