Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11136454 | Thermosetting resin composition and its production method, prepreg, laminate, and printed wiring board | Keisuke Kushida, Hiroshi Shimizu, Minoru Kakitani, Yoshikatsu Shiraokawa | 2021-10-05 |
| 10940674 | Resin varnish, prepreg, laminate, and printed wiring board | Yoshikatsu Shiraokawa, Minoru Kakitani, Hiroshi Shimizu, Keisuke Kushida | 2021-03-09 |