Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11041045 | Resin composition, prepreg, laminate and multilayer printed wiring board | Yasuyuki Mizuno, Tomio Fukuda, Takao Tanigawa, Hikari Murai | 2021-06-22 |
| 10957964 | Multilayer transmission line plate | Takao Tanigawa, Tetsurou Irino, Yuusuke Kondou, Etsuo Mizushima, Tomio Fukuda | 2021-03-23 |