Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11041045 | Resin composition, prepreg, laminate and multilayer printed wiring board | Yuki Nagai, Tomio Fukuda, Takao Tanigawa, Hikari Murai | 2021-06-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11041045 | Resin composition, prepreg, laminate and multilayer printed wiring board | Yuki Nagai, Tomio Fukuda, Takao Tanigawa, Hikari Murai | 2021-06-22 |