Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11203087 | Flux and solder paste | Masato Shiratori, Tomohisa Kawanago | 2021-12-21 |
| 11185950 | Cu ball, Osp-treated Cu ball, Cu core ball, solder joint, solder paste, formed solder, and method for manufacturing Cu ball | Daisuke Soma | 2021-11-30 |
| 11179813 | Flux and solder paste | Yasuhiro Kajikawa, Hiroshi Sugii, Yoshinori Hiraoka | 2021-11-23 |
| 11130202 | Flux, and solder paste | Masato Shiratori, Yoshinori Takagi | 2021-09-28 |
| 10987764 | Flux and solder paste | Masato Shiratori, Ko Inaba, Hiroaki Kawamata, Kazuhiro Minegishi | 2021-04-27 |
| 10888957 | Soldering material | Tomoaki Nishino, Takahiro Roppongi, Isamu Sato, Yuji Kawamata | 2021-01-12 |
| 10888959 | Cu core ball, solder joint, solder paste and formed solder | Shigeki Kondoh, Hiroki Sudo, Masato Tsuchiya, Takashi Yashima, Takahiro Roppongi +1 more | 2021-01-12 |