Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10888959 | Cu core ball, solder joint, solder paste and formed solder | Hiroyoshi Kawasaki, Shigeki Kondoh, Masato Tsuchiya, Takashi Yashima, Takahiro Roppongi +1 more | 2021-01-12 |