Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10888957 | Soldering material | Hiroyoshi Kawasaki, Tomoaki Nishino, Isamu Sato, Yuji Kawamata | 2021-01-12 |
| 10888959 | Cu core ball, solder joint, solder paste and formed solder | Hiroyoshi Kawasaki, Shigeki Kondoh, Hiroki Sudo, Masato Tsuchiya, Takashi Yashima +1 more | 2021-01-12 |