Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11097379 | Solder bonding method and solder joint | Tetsu Takemasa, Tadashi Kosuga | 2021-08-24 |
| 10987764 | Flux and solder paste | Hiroyoshi Kawasaki, Masato Shiratori, Hiroaki Kawamata, Kazuhiro Minegishi | 2021-04-27 |