Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11097379 | Solder bonding method and solder joint | Ko Inaba, Tadashi Kosuga | 2021-08-24 |
| 11024598 | Metallic sintered bonding body and die bonding method | Minoru Ueshima | 2021-06-01 |