Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11024598 | Metallic sintered bonding body and die bonding method | Tetsu Takemasa | 2021-06-01 |
| 10968932 | Soldered joint and method for forming soldered joint | Yoshie Tachibana | 2021-04-06 |