Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11097379 | Solder bonding method and solder joint | Ko Inaba, Tetsu Takemasa | 2021-08-24 |
| 11094658 | Substrate, electronic substrate, and method for producing electronic substrate | Tin-Lup Wong | 2021-08-17 |