Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171119 | Semiconductor module including a semiconductor package connected to a module substrate and a bonding wire | Kyungseon Hwang, Wonyoung Kim | 2021-11-09 |
| 11037894 | Semiconductor device having metal bump and method of manufacturing the same | Won Young Kim, Chanho Lee | 2021-06-15 |