Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171119 | Semiconductor module including a semiconductor package connected to a module substrate and a bonding wire | Wonyoung Kim, Jinchan Ahn | 2021-11-09 |
| 10943881 | Semiconductor package | Ae-Nee Jang, Sunwon Kang | 2021-03-09 |