Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11037894 | Semiconductor device having metal bump and method of manufacturing the same | Jinchan Ahn, Chanho Lee | 2021-06-15 |
| 10985138 | Semiconductor package having a plurality of chips and method of manufacturing the same | Sunwon Kang | 2021-04-20 |
| 10930618 | Semiconductor package having chip stack | — | 2021-02-23 |