Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11063021 | Microelectronics package with vertically stacked dies | Julio C. Costa, Robert Aigner, Gernot Fattinger, Dirk Robert Walter Leipold, George Maxim +2 more | 2021-07-13 |
| 10882740 | Wafer-level package with enhanced performance and manufacturing method thereof | Julio C. Costa, Jon Chadwick, David Jandzinski, Jonathan Hale Hammond | 2021-01-05 |