Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069590 | Wafer-level fan-out package with enhanced performance | Julio C. Costa, Jon Chadwick | 2021-07-20 |
| 10964554 | Wafer-level fan-out package with enhanced performance | Julio C. Costa | 2021-03-30 |
| 10882740 | Wafer-level package with enhanced performance and manufacturing method thereof | Julio C. Costa, Jon Chadwick, David Jandzinski, Merrill Albert Hatcher, Jr. | 2021-01-05 |