Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069590 | Wafer-level fan-out package with enhanced performance | Jonathan Hale Hammond, Julio C. Costa | 2021-07-20 |
| 11063021 | Microelectronics package with vertically stacked dies | Julio C. Costa, Robert Aigner, Gernot Fattinger, Dirk Robert Walter Leipold, George Maxim +2 more | 2021-07-13 |
| 10882740 | Wafer-level package with enhanced performance and manufacturing method thereof | Julio C. Costa, David Jandzinski, Merrill Albert Hatcher, Jr., Jonathan Hale Hammond | 2021-01-05 |