Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10905007 | Contact pads for electronic substrates and related methods | John August Orlowski, Thomas Scott Morris | 2021-01-26 |
| 10882740 | Wafer-level package with enhanced performance and manufacturing method thereof | Julio C. Costa, Jon Chadwick, Merrill Albert Hatcher, Jr., Jonathan Hale Hammond | 2021-01-05 |
| 10888040 | Double-sided module with electromagnetic shielding | Thomas Scott Morris, Brian Howard Calhoun | 2021-01-05 |