Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183447 | Flip-chip package substrate and method for fabricating the same | Pao-Hung Chou, Chun-Hsien Yu | 2021-11-23 |
| 11139230 | Flip-chip package substrate and method for preparing the same | Pao-Hung Chou, Chun-Hsien Yu | 2021-10-05 |
| 11081435 | Package substrate and flip-chip package circuit including the same | Che-Wei Hsu | 2021-08-03 |
| 11031329 | Method of fabricating packaging substrate | Chu-Chin Hu, Che-Wei Hsu, Chin-Ming Liu, Chih-Kuai Yang | 2021-06-08 |
| 10896882 | Electronic package having heat dissipating element and method for fabricating the same | Che-Wei Hsu, Chih-Kuai Yang | 2021-01-19 |