Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031329 | Method of fabricating packaging substrate | Chu-Chin Hu, Shih-Ping Hsu, Che-Wei Hsu, Chih-Kuai Yang | 2021-06-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031329 | Method of fabricating packaging substrate | Chu-Chin Hu, Shih-Ping Hsu, Che-Wei Hsu, Chih-Kuai Yang | 2021-06-08 |