Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031329 | Method of fabricating packaging substrate | Chu-Chin Hu, Shih-Ping Hsu, Che-Wei Hsu, Chin-Ming Liu | 2021-06-08 |
| 10896882 | Electronic package having heat dissipating element and method for fabricating the same | Shih-Ping Hsu, Che-Wei Hsu | 2021-01-19 |