Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183447 | Flip-chip package substrate and method for fabricating the same | Pao-Hung Chou, Shih-Ping Hsu | 2021-11-23 |
| 11139230 | Flip-chip package substrate and method for preparing the same | Pao-Hung Chou, Shih-Ping Hsu | 2021-10-05 |