Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11163216 | Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Zhenyu Chen, Nan Guo +4 more | 2021-11-02 |
| 11039052 | Camera module and molding circuit board assembly, circuit board and application thereof | Mingzhu Wang, Fengsheng Xi, Bojie Zhao, Takehiko Tanaka, Zhen Huang +2 more | 2021-06-15 |
| 11032454 | Circuit board, molded photosensitive assembly and manufacturing method therefor, photographing module, and electronic device | Mingzhu Wang, Zhenyu Chen, Takehiko Tanaka, Bojie Zhao, Nan Guo +1 more | 2021-06-08 |
| 10979610 | Camera module, molding photosensitive assembly thereof, manufacturing method and electronic device | Mingzhu Wang, Zhongyu Luan, Liefeng CHEN, Bojie Zhao, Takehiko Tanaka +1 more | 2021-04-13 |