Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11039052 | Camera module and molding circuit board assembly, circuit board and application thereof | Mingzhu Wang, Duanliang Cheng, Bojie Zhao, Takehiko Tanaka, Zhen Huang +2 more | 2021-06-15 |
| 10908324 | Molded photosensitive assembly of array imaging module | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhenyu Chen +4 more | 2021-02-02 |