Issued Patents 2021
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11165941 | Array camera module and application thereof | Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka | 2021-11-02 |
| 11163216 | Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device | Mingzhu Wang, Takehiko Tanaka, Zhenyu Chen, Nan Guo, Zhen Huang +4 more | 2021-11-02 |
| 11161291 | Molded circuit board of camera module, manufacturing equipment and manufacturing method for molded circuit board | Mingzhu Wang, Takehiko Tanaka, Zhen Huang | 2021-11-02 |
| 11139328 | Manufacture of semiconductor module with transparent molding component | Mingzhu Wang, Takehiko Tanaka, Nan Guo, Zhenyu Chen | 2021-10-05 |
| 11128787 | Array camera module having height difference, circuit board assembly and manufacturing method therefor, and electronic device | Mingzhu Wang, Takehiko Tanaka, Zhenyu Chen, Nan Guo, Zhewen Mei | 2021-09-21 |
| 11099353 | Adjustable optical lens and camera module, manufacturing method and applications thereof | Mingzhu Wang, Heng Jiang, Liang Ding, Feifan Chen, Chunmei Liu +2 more | 2021-08-24 |
| 11094727 | Camera module, molding photosensitive assembly thereof, manufacturing method thereof and electronic device | Mingzhu Wang, Takehiko Tanaka, Nan Guo, Zhenyu Chen | 2021-08-17 |
| 11081518 | Semiconductor packaging method and semiconductor device based on molding process | Mingzhu Wang, Takehiko Tanaka, Zhenyu Chen, Heng Jiang, Nan Guo | 2021-08-03 |
| 11051400 | Camera module with compression-molded circuit board and manufacturing method thereof | Mingzhu Wang, Nan Guo, Feifan Chen, Bo Peng, Zhen Huang | 2021-06-29 |
| 11049898 | Systems and methods for manufacturing semiconductor modules | Mingzhu Wang, Nan Guo, Jingfei He, Zhenyu Chen, Takehiko Tanaka +4 more | 2021-06-29 |
| 11039052 | Camera module and molding circuit board assembly, circuit board and application thereof | Mingzhu Wang, Duanliang Cheng, Fengsheng Xi, Takehiko Tanaka, Zhen Huang +2 more | 2021-06-15 |
| 11032454 | Circuit board, molded photosensitive assembly and manufacturing method therefor, photographing module, and electronic device | Mingzhu Wang, Zhenyu Chen, Duanliang Cheng, Takehiko Tanaka, Nan Guo +1 more | 2021-06-08 |
| 11025805 | System-level camera module with electrical support and manufacturing method thereof | Mingzhu Wang, Feifan Chen, Liang Ding, Nan Guo, Ye Wu +1 more | 2021-06-01 |
| 10986258 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka, Zilong Deng | 2021-04-20 |
| 10986257 | Camera module and manufacturing method thereof | Zhen Huang, Qimin Mei, Zhewen Mei, Li-Wei Liu, Jiawei Chen +2 more | 2021-04-20 |
| 10976514 | Adjustable optical lens and camera module and manufacturing method thereof | Mingzhu Wang, Liang Ding, Chunmei Liu, Feifan Chen, Nan Guo +1 more | 2021-04-13 |
| 10979610 | Camera module, molding photosensitive assembly thereof, manufacturing method and electronic device | Mingzhu Wang, Zhongyu Luan, Liefeng CHEN, Duanliang Cheng, Takehiko Tanaka +1 more | 2021-04-13 |
| 10958816 | Camera module and manufacturing method thereof | Mingzhu Wang, Takehiko Tanaka, Zhen Huang, Nan Guo | 2021-03-23 |
| 10928605 | Adjustable optical lens and camera module and manufacturing method thereof | Mingzhu Wang, Liang Ding, Chunmei Liu, Feifan Chen, Nan Guo +1 more | 2021-02-23 |
| 10908324 | Molded photosensitive assembly of array imaging module | Mingzhu Wang, Takehiko Tanaka, Nan Guo, Zhenyu Chen, Heng Jiang +4 more | 2021-02-02 |
| 10897611 | Fixed-focus photographing module and focusing device and method thereof | Zhenyu Chen, Mingzhu Wang, Xiaojuan Su | 2021-01-19 |