Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11049898 | Systems and methods for manufacturing semiconductor modules | Mingzhu Wang, Nan Guo, Jingfei He, Zhenyu Chen, Bojie Zhao +4 more | 2021-06-29 |
| 10979610 | Camera module, molding photosensitive assembly thereof, manufacturing method and electronic device | Mingzhu Wang, Liefeng CHEN, Duanliang Cheng, Bojie Zhao, Takehiko Tanaka +1 more | 2021-04-13 |
| 10908324 | Molded photosensitive assembly of array imaging module | Mingzhu Wang, Bojie Zhao, Takehiko Tanaka, Nan Guo, Zhenyu Chen +4 more | 2021-02-02 |