Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011506 | Bonded structure including a performance-optimized support chip and a stress-optimized three-dimensional memory chip and method for making the same | Naohiro Hosoda, Kazuma Shimamoto, Tetsuya Shirasu, Akio Nishida | 2021-05-18 |
| 10964715 | Three-dimensional memory device containing channels with laterally pegged dielectric cores | Manabu Kakazu, Takashi Yuda | 2021-03-30 |
| 10957680 | Semiconductor die stacking using vertical interconnection by through-dielectric via structures and methods for making the same | Shinsuke Yada, Masanori Tsutsumi, Sayako Nagamine, Akio Nishida, Christopher J. Petti | 2021-03-23 |