Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11037884 | Semiconductor package having through-hole including shielding wiring structure | Dae-Hyun Park, Sang Jong Lee, Chul Kyu KIM, Jae Hyun Lim | 2021-06-15 |
| 10998362 | Fan-out sensor package | Jae Hyun Lim, Kyung Moon JUNG, Eun Jin Kim | 2021-05-04 |
| 10886192 | Semiconductor package | Jae Hyun Lim, Han KIM, Sang Jong Lee | 2021-01-05 |