Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11155691 | Method for reproducing polyester container and polyester film used in the method | Yongdeuk Kim, Joo Ho YANG | 2021-10-26 |
| 11037884 | Semiconductor package having through-hole including shielding wiring structure | Yoon Seok Seo, Dae-Hyun Park, Sang Jong Lee, Jae Hyun Lim | 2021-06-15 |
| 10994880 | Heat shrinkable film and preparation method thereof | Yongdeuk Kim | 2021-05-04 |
| 10887983 | Printed circuit board | Sung Jun Lim, Seong Hwan Park, Kyung Ho Lee, Kyung Moon JUNG | 2021-01-05 |