Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081283 | Multi-layered ceramic electronic component and mounting board thereof | Yun Tae Lee, Han Kim | 2021-08-03 |
| 10998362 | Fan-out sensor package | Jae Hyun Lim, Yoon Seok Seo, Eun Jin Kim | 2021-05-04 |
| 10887983 | Printed circuit board | Sung Jun Lim, Seong Hwan Park, Kyung Ho Lee, Chul Kyu KIM | 2021-01-05 |