Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164838 | Semiconductor package including plurality of semiconductor chips on common connection structure | Yun Tae Lee, Jung Ho Shim | 2021-11-02 |
| 11108229 | Electrostatic discharge (ESD) protection circuit and integrated circuit including the same | Sung-Pil Jang, Chang-Su Kim, Moon Seok Yang, Kyoung-Ki Jeon | 2021-08-31 |
| 10985126 | Semiconductor package | Jungho SHIM, Chulkyu Kim | 2021-04-20 |
| 10923464 | Connection system of semiconductor packages using a printed circuit board | Yun Tae Lee, Hyung Joon Kim | 2021-02-16 |
| 10886192 | Semiconductor package | Jae Hyun Lim, Yoon Seok Seo, Sang Jong Lee | 2021-01-05 |