Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164838 | Semiconductor package including plurality of semiconductor chips on common connection structure | Yun Tae Lee, Han KIM | 2021-11-02 |
| 11069666 | Semiconductor package | Chui Kyu Kim, Dae-Hyun Park, Jae Hyun Lim, Mi-Ja Han, Sang Jong Lee +1 more | 2021-07-20 |
| 10957670 | Package-on-package and package connection system comprising the same | Hyung Joon Kim, Seok Hwan Kim, Sung Il Jo | 2021-03-23 |