Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10985125 | Chip package structure | Kuan-Yu Huang, Sung-Hui Huang, Shu-Chia Hsu, Leu-Jen Chen, Shang-Yun Hou +4 more | 2021-04-20 |
| 10969272 | Method, system, and sensor assembly for determining light composition at a target location | Nadarajah Narendran, Yiting Zhu, Jean Paul Freyssinier, Dinusha Thotagamuwa | 2021-04-06 |