Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211273 | Carrier substrate and packaging method using the same | Ji-Han Ko | 2021-12-28 |
| 10910339 | Flip chip bonding method | Hwail Jin, Yongwon Choi, Myung-Sung Kang, Yeongseok Kim | 2021-02-02 |
WK
Wonkeun Kim
Overall (2021): #99,149 of 548,734Top 20%
2
Patents 2021