Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211273 | Carrier substrate and packaging method using the same | Wonkeun Kim | 2021-12-28 |
| 11205637 | Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics | Won Keun Kim, Kyung Suk Oh, Kil-Soo Kim, Yeong Seok Kim, Joung Phil Lee +2 more | 2021-12-21 |