Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205637 | Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristics | Won Keun Kim, Kyung Suk Oh, Ji-Han Ko, Kil-Soo Kim, Yeong Seok Kim +2 more | 2021-12-21 |