YC

Yongwon Choi

Samsung: 1 patents #7,111 of 16,990Top 45%
📍 Bryn Mawr, PA: #10 of 16 inventorsTop 65%
🗺 Pennsylvania: #2,483 of 7,685 inventorsTop 35%
Overall (2021): #200,900 of 548,734Top 40%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10910339 Flip chip bonding method Hwail Jin, Myung-Sung Kang, Yeongseok Kim, Wonkeun Kim 2021-02-02