Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10923465 | Semiconductor device having stacked semiconductor chips and method for fabricating the same | Won-Gi Chang, Dongwon Lee, Hyein Yoo | 2021-02-16 |
| 10910339 | Flip chip bonding method | Hwail Jin, Yongwon Choi, Yeongseok Kim, Wonkeun Kim | 2021-02-02 |