Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145563 | Semiconductor devices having cutouts in an encapsulation material and associated production methods | Christian Geissler, Claus Waechter, Maciej Wojnowski | 2021-10-12 |
| 10916484 | Electronic device including redistribution layer pad having a void | Robert Fehler, Francesca Arcioni, Christian Geissler, Gerhard Haubner, Thorsten Meyer +2 more | 2021-02-09 |