Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171101 | Process for removing bond film from cavities in printed circuit boards | James E. Benedict, Paul A. Danello, Mikhail Pevzner, Andrew R. Southworth | 2021-11-09 |
| 11158955 | Low profile phased array | John P. Haven, James E. Benedict, Jonathan E. Nufio-Molina, Andrew R. Southworth | 2021-10-26 |
| 11145952 | Advanced communications array | John P. Haven, Kevin Wilder, James E. Benedict, Andrew R. Southworth, Mary K. Herndon | 2021-10-12 |
| 11145977 | Interlocking modular beamformer | Kevin Wilder, Jonathan E. Nufio-Molina, Phillip W. Thiessen, James E. Benedict, Andrew R. Southworth +1 more | 2021-10-12 |
| 11122692 | Preparation of solder bump for compatibility with printed electronics and enhanced via reliability | James E. Benedict, Gregory G. Beninati, Mikhail Pevzner, Andrew R. Southworth | 2021-09-14 |
| 11121474 | Additive manufacturing technology (AMT) low profile radiator | John P. Haven, Peter J. Adams, James E. Benedict | 2021-09-14 |
| 11109489 | Apparatus for fabricating Z-axis vertical launch within a printed circuit board | Mikhail Pevzner, James E. Benedict, Andrew R. Southworth, Kevin Wilder, Matthew Souza +1 more | 2021-08-31 |
| 11107610 | Thick film resistors having customizable resistances and methods of manufacture | Erika Klek, Mary K. Herndon, James E. Benedict, Andrew R. Southworth, Kevin Wilder +2 more | 2021-08-31 |
| 11089673 | Wall for isolation enhancement | Andrew R. Southworth, Kevin Wilder, James E. Benedict, Mary K. Herndon, John P. Haven | 2021-08-10 |
| 11089687 | Additive manufacturing technology (AMT) low profile signal divider | Jonathan E. Nufio-Molina, James E. Benedict, Andrew R. Southworth, Semira M. Azadzoi | 2021-08-10 |