Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171101 | Process for removing bond film from cavities in printed circuit boards | James E. Benedict, Paul A. Danello, Thomas V. Sikina, Andrew R. Southworth | 2021-11-09 |
| 11122692 | Preparation of solder bump for compatibility with printed electronics and enhanced via reliability | James E. Benedict, Gregory G. Beninati, Thomas V. Sikina, Andrew R. Southworth | 2021-09-14 |
| 11109489 | Apparatus for fabricating Z-axis vertical launch within a printed circuit board | James E. Benedict, Andrew R. Southworth, Thomas V. Sikina, Kevin Wilder, Matthew Souza +1 more | 2021-08-31 |
| 10999938 | Method of wire bonding a first and second circuit card | Donald G. Hersey, Gregory G. Beninati, Thomas J. Tellinghuisen, James E. Benedict | 2021-05-04 |