Issued Patents 2021
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171101 | Process for removing bond film from cavities in printed circuit boards | James E. Benedict, Paul A. Danello, Mikhail Pevzner, Thomas V. Sikina | 2021-11-09 |
| 11158955 | Low profile phased array | Thomas V. Sikina, John P. Haven, James E. Benedict, Jonathan E. Nufio-Molina | 2021-10-26 |
| 11145952 | Advanced communications array | Thomas V. Sikina, John P. Haven, Kevin Wilder, James E. Benedict, Mary K. Herndon | 2021-10-12 |
| 11145977 | Interlocking modular beamformer | Kevin Wilder, Jonathan E. Nufio-Molina, Phillip W. Thiessen, Thomas V. Sikina, James E. Benedict +1 more | 2021-10-12 |
| 11122692 | Preparation of solder bump for compatibility with printed electronics and enhanced via reliability | James E. Benedict, Gregory G. Beninati, Mikhail Pevzner, Thomas V. Sikina | 2021-09-14 |
| 11109489 | Apparatus for fabricating Z-axis vertical launch within a printed circuit board | Mikhail Pevzner, James E. Benedict, Thomas V. Sikina, Kevin Wilder, Matthew Souza +1 more | 2021-08-31 |
| 11107610 | Thick film resistors having customizable resistances and methods of manufacture | Erika Klek, Mary K. Herndon, Thomas V. Sikina, James E. Benedict, Kevin Wilder +2 more | 2021-08-31 |
| 11089673 | Wall for isolation enhancement | Kevin Wilder, James E. Benedict, Mary K. Herndon, Thomas V. Sikina, John P. Haven | 2021-08-10 |
| 11089687 | Additive manufacturing technology (AMT) low profile signal divider | Jonathan E. Nufio-Molina, Thomas V. Sikina, James E. Benedict, Semira M. Azadzoi | 2021-08-10 |