Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11122692 | Preparation of solder bump for compatibility with printed electronics and enhanced via reliability | James E. Benedict, Mikhail Pevzner, Thomas V. Sikina, Andrew R. Southworth | 2021-09-14 |
| 10999938 | Method of wire bonding a first and second circuit card | Mikhail Pevzner, Donald G. Hersey, Thomas J. Tellinghuisen, James E. Benedict | 2021-05-04 |