Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004700 | Temporary post-assisted embedding of semiconductor dies | Richard Knipper | 2021-05-11 |
| 10971457 | Semiconductor device comprising a composite material clip | Thomas Bemmerl, Martin Gruber | 2021-04-06 |
| 10964628 | Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture | Martin Gruber, Josef Hoeglauer, Michael Juerss, Josef Maerz, Thorsten Meyer +1 more | 2021-03-30 |
| 10903180 | Device including semiconductor chips and method for producing such device | Petteri Palm | 2021-01-26 |
| 10886186 | Semiconductor package system | Ralf Otremba, Thomas Bemmerl, Irmgard Escher-Poeppel, Martin Gruber, Michael Juerss +2 more | 2021-01-05 |